G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-Minienvironments

G03000 - SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages StdTpc-MinienvironmentsThis Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1986; previously published in 1988. NOTICE: This Document was reapproved with minor editorial changes. The purpose of this test is to determine the thermal

6-1103 (Reapproved 1211)

SEMI MF1388-0707 (technical revision)

orgで入手可能になり。初版は1993年発行。前版は1994年発行。

manufacturing control

The test method is applicable to circular silicon wafers from 50 mm (or 2

to be published February 2000

This Document provides a common basis for communication between manufacturers and users

· オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。

SEMI MF95-1107 (Reapproved 1012)

within semiconductor device manufacturing facilities

SEMI C30-0301 (technical revision)

SEMI M57-0704 (first published)