E11400 - SEMI E114 - Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems StdTpc-FPD Substrates to be published September 1999

to be published September 1999

— 本仕様は，要求メッセージと対応する応答メッセージでの要求／応答の実行に必要なメッセージヘッダを示す。

While this Standard requires that a capability shall exist for actuation of process program parameters to influence key EQIPs

displacement of flatband voltage after application of voltage stress at elevated temperatures

E11400 - SEMI E114 - Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems StdTpc-FPD Substrates to be published September 1999The purpose of this Standard is to define a test method used to determine the electrical length, power losses, and characteristic impedance variation of RF cable assemblies used in RF power delivery systems for semiconductor processing equipment. This Standard specifies the testing procedures and test equipment required for the following: Determining the electrical length of RF cable assemblies at the nominal operating frequency in terms of degrees of