Bonding Head Adapter for HP-X1S Ren Thang Flexible component handling: supports waffle
$297.50
Description
Flexible component handling: supports waffle trays
The system performs testing at ambient temperature
The MC385V2V can be equipped with an optional Advanced Time Pressure (ATP) dispensing head
5 meters in length
Bonding Head Adapter for HP-X1S Ren Thang Flexible component handling: supports waffle
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
