MF152900 - SEMI MF1529 - Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure Revision:SEMI MF1529-1110 - Superseded Thermal decomposition temperature (see SEMI

Thermal decomposition temperature (see SEMI G75

3-1016 (Reapproved 0224)

SEMI D51 — Specification for Handshake Protocol of Single Substrate for Handling off/on Tool in FPD Production

b and hue a*

MF152900 - SEMI MF1529 - Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure Revision:SEMI MF1529-1110 - Superseded Thermal decomposition temperature (see SEMIThe sheet resistance of epitaxial, implanted, diffused or deposited films is an important materials acceptance and process control parameter. The uniformity across a wafer of the sheet resistance resulting from any of these processes is important for the equivalence of performance of devices or circuits made from various regions of the wafer. This Test Method uses a four point probe in a manner different from that of other ASTM methods for the