G06300 - SEMI G63 - ダイ剪断強度の測定方法 StdVol-3D-IC The model specified in this

The model specified in this Specification is used in conjunction with the Sensor/Actuator Network Common Device Model (CDM) to completely describe the MFC or MFM as it appears from the network interface

This standard is intended to set levels of specification for a reusable cassette to ship clean glass substrates and process-added substrates between organizations without compromising substrate integrity

such as caustics and oxidizers

SEMI D53-0421 (technical revision)

G06300 - SEMI G63 - ダイ剪断強度の測定方法 StdVol-3D-IC The model specified in thisglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org199520023 : Referenced SEMI Standards None.