86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer Holders Protection and Auto-recover

Protection and Auto-recover

Pressure Calibration Kit: Load cell (Unit Kg) + Digital Meter

You may order an internal resistance tester to measure DC resistivity (click the second and third picture below for more information)

Film target thickness:       11 um  with  (thickness acceptation range) +/- 10%

86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer Holders Protection and Auto-recoverSPECIFICATIONS: Part Number EQ EC 422 Blade Material Nickel bounded Stainless Steel Blade Diameter 86mm OD x 70 mm ID Blade Thickness 0. 1mm Center hole 0. 5" Grain Size 14 microns Features High precision cutting for hard and brittle nonmetal materials such as Si, Ge, Quartz, Ceramic, Ferrite and Glass, etc. Designed for SYJ 400 Dicing saw and Compatible with any dicing saw with 0. 5" diameter shaft. Replacement blade for aluminum alloy flange (not