GaP Wafer, Undoped (111) 3"x0.45 mm, 1sp Fittings Boosting the interfacial superionic conduction

Boosting the interfacial superionic conduction of halide solid electrolytes for all-solid-state batteries

Heating elements are very brittle and could break if the separator is too wide or if too much pressure is applied on them

The SiC blade fit with MTI SYJ-150 low speed saw or other brand of low speed saw

Made of SS304 stainless steel

GaP Wafer, Undoped (111) 3"x0.45 mm, 1sp Fittings Boosting the interfacial superionic conductionSpecifications: GaP single crystal wafer Doping: Undoped Orientation: (111) Size: 3" diameter x 0. 45 mm Polished: one side polished Carrier Concentration: 6. 6x10^16 cm 3 Resistivity: 0. 74 Ohm. cm Mobility: 126 cm^2 Vs EPD: <2x10^5 cm 2 Surface finish (RMS or Ra) : < 8A Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater