Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-132972 including those produced by computer

including those produced by computer

it is included in BS EN 10225-4

It gives guidance which is complementary to that found in BS EN ISO 9000

This standard sets out principles to be followed for both layout and calculation

Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-132972 including those produced by computerWhat is BS IEC 63011 3 about? BS IEC 63011 3 is the third part of the BS IEC 63011 series of standards that specifies a reference model of through silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3 D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3 D IC. Note: 3 D IC specifications covered by BS