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Cycles - Specification for stem wedge angle Ingestion-build-205840 Designation of the direct tension

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Designation of the direct tension indicator

This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method

amongst others

experimental results are given

Cycles - Specification for stem wedge angle Ingestion-build-205840 Designation of the direct tension

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